WE ARE Linked Electronics

Innovative PCB Solutions

With many years of continuous innovation and improvement based on customers' needs, Linked Electronics has been becoming one of the most reliable printed circuit board suppliers

Economical

We are committed to providing our customers with the most cost-effective PCB solutions indefinitely.

Efficient

We specializing in the PCBs for over ten years

High Quality

Ensuring quality is one of the main guidelines of our company.

About Us

We specializing in the PCBs over ten years

We provide fulfill from quick-turn prototypes to medium volume requirements by meeting the needs of our customers and creating the best customer experience in the industry.

Learn More
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OUR SERVICE

Create Ultimate Experience

We provide fulfill from quick-turn prototypes to medium volume requirements by meeting the needs of our customers and creates the best customer experience in the industry.

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CSP

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FC CSP

2Layer

2Layer PCB

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4Layer PCB

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8Layer PCB

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10Layer PCB

others

20Layer PCB

others

28Layer PCB

others

32Layer PCB

others

50Layer PCB

Flex-Rigid

14Layer Flex-Rigid PCB

Flex PCB

6Layer Flex PCB

Flex PCB

8Layer Flex PCB

Flex PCB

4Layer Semiflexible PCB

What Is New

New Project

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LBGA

  • Layer : 2 L
  • Spacing : 1270 um
  • Pads No.: 144
  • Unit Size : 16*16±0.1 mm
  • Max Size : 240*74mm
  • Finish Thickness : 0.6±0.08 mm
  • Chip Material : HL832NXA
  • Chip Thickness : 500 um
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    COB

  • Layer : 8L 3+N+3
  • Spacing : P 0.6
  • Pads No. : 401109
  • Pads Size : 120*120 um
  • Surface Finishing : Gold Plating
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    IMD

  • Layer : 10L 4+N+4
  • Spacing : P 0.9
  • Pads No. : 196574
  • Pads Size : 220*220 um
  • Surface Finishing : Gold Plating
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    Microwave PCB

  • Type : Multilayer Microwave PCB with Multiple Steps and Buried/Blind Vias
  • Layer : 4-18 L
  • Line Width/Spacing : ±0.05 mm
  • Slot Depth Accuracy : ±0.0127 mm
  • Characteristics : Multiple Step Slot, Blind Via in Slot, PTFE Impregnation
  • Frequency : Millimeter-wave and Sub-millimeter-wave Frequencies
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    High Frequency

  • Type : High-Frequency, High-Speed, High-Layer
  • Layer : 4-36 L
  • Transmission Speed : 128GBps
  • Impedance : ±5%(100Ω), ±7%(50Ω)
  • Characteristics : Multilayer, Back Drilling, Low Resistance, Edge Plating
  • Application : Signal Processing, Servers, Backplanes
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    High Copper

  • Type : High Copper Thickness, High Thermal Conductivity, High Power Multilayer
  • Layer : 4-16 L
  • Copper Thickness : Inner 80oz, outer 50oz
  • Thermal Conductivity : 15W/MK
  • Characteristics : Thick Copper Foil, High Thermal Conductivity Resin, Buried Copper Board
  • Application : Power Supply, Busbar, Motor

    • Success Depends on a Right Plan

    Right Now

    What we can do

    120,000

    M²/MONTH

    33

    Countries Covered

    457

    Orders Daily
    OUR Strengths

    Make Development Easier

    Whether you’re creating your first PCB, or developing an electronic hardware product, we’re here to help you build hardware easier and faster by providing rapid PCB prototypes. We're constantly looking for new ways to improve and shorten the PCB prototyping process — from pioneering online quoting/ordering system, and automatic production to fast delivery.

    Higher Quality
    95%
    Lower Cost
    60%
    Faster Delivery
    70%
    More About Us
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