What We Product
IC Substrate FC-CSP
FC-CSP is a type of chip-scale package that employs flip chip technology. In a flip chip configuration, the semiconductor die is mounted upside down, with its active side facing downward, and the electrical connections (solder bumps or balls) on the die directly connect to corresponding contact points on the substrate. This configuration allows for shorter interconnects, improved electrical performance, and efficient heat dissipation.
Flip Chip
FC-CSP utilizes flip chip technology where the chip is inverted and mounted on the substrate with its active side facing downward. The electrical connections (solder balls or pads) on the chip directly connect to corresponding points on the substrate. This direct connection shortens interconnect distances, improves electrical performance, and aids in effective heat dissipation.
Minimized Chip Size
The design objective of FC-CSP is to minimize the overall package size, closely matching the dimensions of the chip itself. Compared to traditional packaging technologies, FC-CSP reduces the package size, enhancing flexibility in the layout of integrated circuits on the printed circuit board (PCB).
High-Density Interconnect
FC-CSP employs high-density solder balls or pads, forming a compact interconnect structure. This high-density interconnect enhances signal transmission speed and reduces signal delays on the PCB.
Superior Thermal
Due to the chip being directly mounted on the package's bottom, FC-CSP contributes to superior thermal performance. This is crucial for high-performance applications, especially those sensitive to temperature.
Compact Package Form
FC-CSP adopts a design with minimized chip size and high-density interconnect, resulting in a compact package form. This form is advantageous for applications with space constraints, such as mobile devices and portable electronic equipment.
Suitable for High Integration
With its compact size and high-density interconnect, FC-CSP is well-suited for applications requiring high integration. Multiple functional blocks or chips can be integrated into a single FC-CSP package, forming a System-in-Package (SiP).
Automation-Friendly
FC-CSP's design facilitates automated manufacturing processes, improving production efficiency. This is essential for large-scale manufacturing and cost reduction.
Adaptable
FC-CSP can be applied across various applications, including mobile devices, consumer electronics, automotive electronics, medical electronics, and more.
What We Product
IC Substrate FC-CSP
Where we APPLY
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