What We Product
IC Substrate CSP
Chip Scale Package is a packaging technology that aims to reduce the overall size of the IC package, making it nearly the same size as the semiconductor die itself. CSPs are designed to be compact and often have a form factor that closely matches the dimensions of the integrated circuit.
Compact Size
CSP is designed to minimize the overall package dimensions, closely aligning with the size of the semiconductor chip itself. This design enhances flexibility in circuit layout on the printed circuit board (PCB)
Lightweight
CSP packages typically use lightweight materials such as plastics, contributing to a reduction in the overall weight of electronic devices. This is particularly advantageous for portable devices and other applications with strict weight requirements.
High-Density Interconnect
CSP employs small solder balls, pads, or other compact connection structures, enabling a denser interconnect between the chip and the PCB. This high-density interconnect improves signal transmission speed and reduces signal delays on the PCB.
Superior Thermal
The design of CSP allows the chip to be directly mounted on the package's bottom, contributing to enhanced thermal dissipation. This is crucial for high-performance applications sensitive to temperature.
High Integration
Due to its compact size and high-density interconnect, CSP is well-suited for applications that demand high integration. Multiple functional blocks or chips can be integrated into a single CSP package, forming a System-in-Package (SiP).
Automation-Friendly
CSP's design facilitates automated manufacturing processes, enhancing production efficiency. This is essential for large-scale manufacturing and cost reduction.
Adaptable
CSP can be applied across a range of applications, including mobile devices, consumer electronics, automotive electronics, medical electronics, and more.
What We Product
IC Substrate CSP
Where we APPLY
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