What We Product
IC Substrate PBGA
PBGA is a type of surface mount packaging technology for integrated circuits. It is characterized by a plastic package with an array of solder balls arranged on the bottom surface of the package. The solder balls serve as the electrical connections between the IC and the printed circuit board (PCB)
Plastic Encapsulation
IC Substrate PBGA uses a plastic material for encapsulating the integrated circuit. This plastic housing provides mechanical protection for the IC and contributes to a cost-effective packaging solution
Ball Grid Array
The package utilizes Ball Grid Array technology, where an array of solder balls is arranged on the bottom surface of the package. These solder balls serve as the electrical connections between the IC and the printed circuit board (PCB).
High Pin Count
PBGA packages typically have a high pin count, allowing for the accommodation of a large number of electrical connections. This is beneficial for ICs that require numerous input and output connections.
Surface Mount Technology
PBGA is a surface mount technology, meaning that the package is mounted directly onto the surface of the PCB. This type of packaging is suitable for automated assembly processes and contributes to efficient manufacturing.
Compact Form Factor
PBGA packages are known for their compact form factor, enabling the creation of smaller and more space-efficient electronic devices. The high pin density and reduced package size are advantageous for applications where space is a critical factor.
Thermal Performance
PBGA packages are known for their compact form factor, enabling the creation of smaller and more space-efficient electronic devices. The high pin density and reduced package size are advantageous for applications where space is a critical factor.
Cost-Effective
The combination of plastic encapsulation and BGA technology contributes to cost-effective manufacturing. PBGA packages are suitable for high-volume production and are commonly used in a variety of consumer electronics and industrial applications.
Versatility in Applications
IC Substrate PBGA is versatile and finds applications in various electronic devices, including microprocessors, memory chips, and other integrated circuits where surface mount technology, high pin count, and compact packaging are desirable.
What We Product
IC Substrate PBGA
Where we APPLY
Related Application
Communication
Electrocardiograph
