What We Product
IC Substrate FMC
CSP Integrated Circuit Substrate. It is a lightweight single chip package type with a miniaturized scale. The CSP IC substrate mainly gets deployed in telecommunication and memory products having a small pins number.
Flip Chip
Utilizes flip-chip technology, where the chip is inverted and mounted on the substrate with its active side facing downward. This helps shorten interconnect distances, improve electrical performance, and facilitates effective heat dissipation.
Ball Grid Array
Incorporates Ball Grid Array (BGA) packaging technology, where solder balls are arranged on the bottom of the package for electrical connections and securing the package to the printed circuit board (PCB). This provides reliable electrical connections and is suitable for surface mount technology.
Compact Size
The design objective of IC Substrate FMC is to minimize the overall package size, closely matching the dimensions of the chip itself. This compact form factor is suitable for space-constrained applications, such as mobile devices and portable electronic equipment.
High Integration
FMC packaging can accommodate multiple functional blocks, chips, or devices, enabling a highly integrated design. This is beneficial for applications that require the integration of multiple functions within a small package.
Thermal Performance
Due to the chip being directly mounted on the package's bottom, IC Substrate FMC contributes to improved thermal performance. This is crucial for high-performance applications, especially those sensitive to temperature.
High Integration
With its compact size and highly integrated design, IC Substrate FMC is well-suited for applications that demand high integration. Multiple functional blocks or chips can be integrated into the same FMC package.
Automated Production
The design of FMC is conducive to automated production processes, enhancing production efficiency. This is essential for large-scale manufacturing and cost reduction.
Adaptable
IC Substrate FMC can be applied across various applications, including mobile devices, consumer electronics, automotive electronics, medical electronics, and other fields.
What We Product
IC Substrate FMC
Where we APPLY
Related Application
Antenna
Signal Control System
