Common Questions About PCB Manufacturing
Quick answers to help you get started with your PCB project
What types of PCBs do you manufacture?
We produce IC substrates (CSP, FC-CSP, SiP, FMC, PBGA), rigid PCBs (2-50+ layers), HDI PCBs, flex and rigid-flex PCBs, ceramic PCBs, heavy copper PCBs (up to 10 OZ), and high-frequency PCBs using Rogers, Taconic, and PTFE materials.
What is your minimum order quantity?
We have no strict minimum order quantity. Whether you need 5 prototypes for design verification or 100,000 units for mass production, we are happy to support your project. Our quick-turn service delivers 2-layer prototypes in as fast as 24 hours.
What files do I need to submit for a quote?
For PCB fabrication, submit Gerber files (RS-274X format), drill files, and fabrication notes. For PCBA assembly, also include your BOM (Bill of Materials), centroid/pick-and-place file, and assembly drawings.
What quality certifications do you hold?
Linked Electronics is certified to ISO 9001:2015, ISO 14001:2015, IATF 16949:2016, ISO 45001, GJB9001C (military), UL, and CQC standards. Every PCB undergoes 100% AOI and electrical testing before shipment.
What is your typical lead time?
Standard lead times are 5-7 business days for 2-layer and 7-12 days for multilayer PCBs. Quick-turn service: 24 hours for 2-layer, 48 hours for 4-layer, and 72 hours for 6-8 layer designs. Contact us for your specific requirements.
Do you ship internationally?
Yes, we ship to 30+ countries worldwide via DHL, FedEx, UPS, and TNT. Express shipping typically takes 3-5 business days. We also support freight forwarder accounts and consolidated shipping for larger orders.
What materials do you use?
We stock FR4 (Tg140-Tg180), high-Tg FR4, Rogers (RO4000, RO3000 series), Taconic, polyimide, ceramic (Al2O3, AlN), and aluminum-base IMS from Shengyi, Kingboard, Nanya, DuPont, and other premium suppliers.
Can you do both PCB fabrication and assembly?
Yes! We offer turnkey PCB fabrication and PCBA assembly under one roof, including SMT, through-hole, BGA, and mixed-technology assembly with in-circuit testing (ICT) and functional testing (FCT).