What We Product
IC Substrate SiP
System-in-Package refers to an advanced packaging technology where multiple integrated circuits or functional blocks are integrated into a single package. In a SiP configuration, different ICs, such as microprocessors, memory, sensors, and other components, are combined in a compact form to achieve specific functionalities.
Multi-functional Integration
IC Substrate SiP allows the integration of multiple functional blocks, chips, or devices within the same package. This highly integrated design enables the realization of complex systems in a small package, including processors, memory, sensors, and more.
Compact Size
SiP technology inherently offers compact packaging, and when combined with the design of IC Substrate, results in an even smaller overall package size. This is suitable for space-constrained applications such as portable devices and smart wearables.
Functional Blocks
IC Substrate SiP can integrate multiple functional blocks, chips, or devices into a single package, forming a larger and more sophisticated system.
Flexibility
SiP technology allows designers to combine different types of chips within the same package, providing flexibility to meet the specific requirements of various applications. Designers can select different functional blocks to tailor the SiP for specific use cases.
Shortened Distances
By integrating chips with different functionalities in the same package, IC Substrate SiP shortens the interconnect distances between chips. This helps improve signal transmission speed and reduces signal delays.
Multi-Chip Systems
SiP technology enables the realization of multi-chip systems, enhancing the overall performance of the system. This is crucial for complex applications such as communication devices and embedded systems.
Rapid
The design and manufacturing of IC Substrate SiP are relatively straightforward, contributing to shorter product development cycles and faster time-to-market for new products.
Reliability
IC Substrate SiP combines the reliability of IC Substrate with the thermal performance benefits of SiP. This allows for highly integrated systems in small packages while maintaining system reliability and stability.
What We Product
IC Substrate SiP
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