IC Substrate
Advanced packaging substrates for semiconductor applications
CSP
Chip Scale Package substrates with fine line/space down to 15μm, supporting wafer-level packaging for mobile and IoT applications.
FC-CSP
Flip-Chip CSP substrates with micro-via technology, optimized for high-performance processors and graphics chips requiring 1000+ I/O connections.
SiP
System-in-Package substrates integrating multiple ICs, passive components, and shielding in a single compact module for 5G and automotive applications.
FMC
Flip-Chip Molded Core substrates with embedded trace technology, delivering superior electrical performance for advanced computing applications.
PBGA
Plastic Ball Grid Array substrates with 2-6 layers, offering cost-effective packaging solutions for networking, consumer, and industrial ICs.
Rigid PCB
From single-sided to 50+ layer advanced HDI designs
Double-Sided PCB
Cost-effective 2-layer boards with plated through-holes, ideal for consumer electronics and industrial controls.
Multilayer PCB
4-50+ layer boards with blind/buried vias, impedance control, and mixed material stackups for complex designs.
HDI PCB
High-Density Interconnect with laser-drilled micro-vias, any-layer technology for smartphones, wearables, and AI hardware.
Ceramic PCB
Alumina and aluminum nitride substrates for high-power LED, RF power amplifier, and extreme temperature applications.
Heavy Copper PCB
Up to 10 OZ copper for power electronics, BMS, and motor drives with superior thermal management.
High-Frequency PCB
Rogers, Taconic, and PTFE laminates for RF/microwave applications with tightly controlled impedance and low signal loss.
Flex & Rigid-Flex PCB
Flexible circuit solutions for 3D packaging and dynamic applications
Flex PCB
Single and double-layer flexible circuits on polyimide substrates. Ideal for wearable devices, medical sensors, and compact interconnections.
Rigid-Flex PCB
Hybrid rigid-flex designs combining FR4 component areas with flexible interconnects. Perfect for aerospace, military, and foldable consumer electronics.
Multilayer Flex
4-16 layer flexible circuits with blind/buried vias for high-density dynamic flex applications in robotics and medical devices.